LF361
General purpose Conductive Copper ink—thin layers
Copprint LF361 Copper Ink for high conductivity screen printing on PET/PC substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PET/PC
Key Product Benefits
Drying: Hot air/Reflow oven
Sintering: Hot roller, Hot press
Application: Conductive Copper Ink
Common Applications: Printed electronics
TYPICAL PROPERTIES OF COPPRINT NANO COPPER PASTE (UNCURED)
Particle Size, μm D50 < 1.0, D90 < 3.0
Solid Content, after 10 minutes @150ºC, 84±4
Density, 3.4±0.1 g/ml
Viscosity @ 250C , DVEHA Brookfield spindle 14,100rpm, mPa∙s (cps) 2000-3000
Coverage area @5μm dry film thickness, 31 m²/kg
Shelf Life, @<-10°C, 180 days
Pot life @ 25°C, Hours 72
Sintering cycle
20 sec @180-210 °C (Hot roller)
120 sec @160-200 °C (Hot Pressing)
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Adhesion: (tape test 3M Scotch 234) pass
Cross cut test ISO 2409-2007 4-5 b
Electrical Properties: Sheet resistivity
S2S (Hot press), ohm/□/25 µm <0.006
R2R (Hot Roller), ohm/□/25 µm <0.005
DIRECTIONS FOR NANO COPPER INK USE
Copprint LF361 is supplied as a single-component formulation ready for use.
STORAGE
Store sealed container under -10°C in a dry location.
For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS.
For technical data please see the Technical Data Sheet (TDS)
