Copprint oxidation free copper inks enable printing of any conductive pattern using standard equipment, on a range of substrates.
Copprint TechnologyProduct | Short Description | Viscosity | Sintering Temp °C | Sheet Resistance mΩ/□/25µm | Resistivity µΩ cm | Avg particle size μm | Solid content | Coverage m²/Kg |
LF360 | General Purpose Conductive Copper Ink | 15,000 | 250 190 160 | 3 5 6 | 7.3 12.2 14.6 | D50 < 1.0, D90 < 7.0 | 88% | 11.4 @15µm |
LF361 | General Purpose Conductive Copper Ink, Thin Layers | 2,500 | 190 160 | 5 6 | 12.2 14.6 | D50 < 1.0, D90 < 3.0 | 84% | 31 @5µm |
LF365 | General Purpose Conductive Copper Ink, Thick Layer, Narrow Lines, High Thixotropy | 35,000 | 160 240 300 | 6 3 2.2 | 14.6 7.3 5.4 | D50 < 1.0, D90 < 2.0 | 93% | 12.5@10µm |
LF301 | Conductive Copper Ink, Thin Layer Antennas on Paper | 2,000 | 240-260 | 3 | 7.3 | D50 < 0.15, D90 < 3.0 | 81% | 20.9 @5µm |
LF302 | Conductive Copper Ink, Thick Layer Antenna on Paper | 7,000 | 280 | 2.5 | 6.1 | D50 < 1.0, D90 < 7.0 | 88% | 16.3@13µm |
LF350 | Conductive Nano Copper Ink, High Resolution, Thin Layers | 6,000 | >200 | 4 | 9.8 | D90<0.15 | 81% | 17 @5µm |
LF370 | Conductive Copper Ink, Rigid Substrates | 9,000 | 240-300 | 2.3 | 5.6 | D50 < 0.15, D90 < 5.0 | 88% | 12 @8µm |
LF371 | Conductive Copper Ink, Thick layer, Rigid Substrates | 30,000 | 240-300 | 2.3 | 5.6 | D50 < 1.0, D90 < 7.0 | 90% | 10.5 @11µm |
LF391 | Conductive Copper Ink, Durable, Flexible , PI | 15,000 | <220 | 8 | 19.5 | D50 < 1.0, D90 < 7.0 | 88% | 10.5 @14µm |
LF300 | Conductive Nano Copper ink, PaperBased Flexible Applications | 7,000 | 280-300 | 3 | 7.3 | D90<0.15 | 83% | 17 @5µm |
