We are Copprint, a Nano Copper Ink Company.

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    Copprint Nano Copper inks are enabling printed electronics


    Introducing Copprint

    Copprint is an advanced materials chemical company focused on conductive Nano Copper inks for additive copper printing.
    Our rapid self-sintering Nano Copper Inks are enabling ubiquitous conductivity for printed electronics by delivering high performance, low cost, rapid manufacturing of environmentally friendly conductive inks.
    Copprint Conductive Nano Copper Inks are bringing the benefits of simple additive manufacturing to printed electronics transforming existing and new markets.
    We are transforming flexible electronics markets, delivering a cost effective and sustainable approach for additive printing of photovoltaics, RFID and NFC antennas, flexible electronics and PCB’s, smart fabrics, embedded circuits (IOT) and more.



    Copprint was co-founded in 2016 by Michael Grouchko PhD (chemistry), a world expert in nano-conductive inks and
    Ofer Shochet PhD (physics) an experienced executive and serial entrepreneur.

    The Copprint team includes industry leading chemists, advanced scientists and engineers.

    Copprint Strategic investors:
    Henkel, HP, Tatsuta

    Board of Directors:
    • Dr Paolo Bavaj, Corporate Director, Head of Corporate Venturing, Henkel
    • Dov Ofer, Senior Executive
    • Irit Hillel, Partner HP Tech Ventures (observer)
    • Mitsuhiro (Mike) Sakaguchi, Tatsuta (observer)
    • Dr Michael Grouchko
    • Dr Ofer Shochet
    Printed Electronics Europe


    Join Our Team

    We are looking for excellent people to join our mission!
    Do you want to have a positive impact on additive manufacturing for the electronics industry?
    If you’re enthusiastic about applied chemistry and industry shifting innovation, and want to be part of an innovative and fast growing team – we’d love to meet you!

    Copprint team


    The Latest from Copprint

    Excellent soldering on conductive copper ink demonstrated by the formation of an IMC (InterMetallic Compound) layer Announcement
    Excellent soldering on conductive copper ink demonstrated by the formation of an IMC (InterMetallic Compound) layer
    October 12, 2021

    Additive Manufacturing of Electronics requires good soldering and is enabled with Copprint’s conductive copper inks, as demonstrated by the formation of an IMC layer (Inter Metallic Compound). This layer is formed during reflow between the solder alloy and printed conductive copper paste and is the index of good soldering (see explanation here ).   Full process […]

    Copper Sponsor for CPES2021 Event
    Copper Sponsor for CPES2021
    February 27, 2021

    Copprint is proud to be a Copper Sponsor for CPES2021. For further info see “intelliFLEX to present Virtual CPES2021, March 17-19, 2021”    

    Copprint-Tatsuta Announcement
    December 15, 2020

    We are honored to have TATSUTA Electric Wire and Cable Co., Ltd. as a new investor at Copprint, joining Henkel and HP. https://lnkd.in/du2YjGS See on LinkedIn