LF300
Conductive Nano Copper ink, Paper based Flexible Applications
Copprint LF300 Nano Copper Ink for high conductivity additive screen printing on paper.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: Paper
Key Product Benefits
Drying: hot air
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: UHF and HF antenna & sensors
TYPICAL PROPERTIES: UNCURED NANO COPPER PASTE
Particle Size, μm <0.15
Solid Content, after 10 minutes @150ºC, 81±1%
Density, 2.7±0.15 g/ml
Viscosity @ 250C , DVEHA Brookfield spindle 14, 100rpm, mPa∙s (cps) 5000-9000
Thixotropic Index (1.5/15 s-1) 1.5±0.1
Coverage area @5μm dry film thickness, 17 m²/kg
Shelf Life, @<-10°C, 180 days
Flash Point – See Safety Data Sheet (SDS)
Sintering cycle
30 sec @ 270°C (Hot press)
5 sec @ 300°C (Laminator)
TYPICAL PROPERTIES: CURED NANO COPPER PASTE
Adhesion: tape test 3M Scotch 234 (Passed)
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.003
DIRECTIONS FOR NANO COPPER INK USE
Copprint LF300 is supplied as a single-component formulation ready for use.
SCREEN PROPERTIES
Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 100 to 300
STORAGE AND HANDLING
Store sealed container under -10°C in a dry location.
For safe handling of Copprint Nano Ink consult the Safety Data Sheet (SDS.
For technical data please see the Technical Data Sheet (TDS)
