Design for Additive Manufacturing of PCBs: Cutting Copper, Cutting Carbon
Additive Manufacturing (AM) is revolutionizing PCB design by enabling precise material deposition—placing copper only where it’s needed. Unlike traditional subtractive processes, which wastefully etch away excess copper, AM dramatically reduces copper usage and boosts sustainability.
Designing PCBs specifically for AM (DfAM) unlocks lighter, more efficient boards, slashes material waste, and shrinks the environmental footprint. Transitioning from subtractive etching to AM can cut CO₂e emissions by over 50%. Even if just 0.5% of the PCB industry adopts AM, it could reduce global emissions by more than 100 megatons of CO₂e annually.
Copprint Green PCB: DfAM Advantages
Feature | Standard Etched PCB | Fully Additive PCB |
---|---|---|
Description | FR4 + Plated Through Hole + Copper etching | FR4 + CPTH + Surface Copper Printing |
Laminate | FR4 copper-clad laminate | FR4 laminate without copper |
Manufacturing Method | Subtractive process | Additive process |
Process Flow | CNC → Desmear → Deburr → Electroless Plating → Panel & T/H Plating → Dry Film → Developing → Etching → Stripping → Solder Mask → OSP | CNC → Copper Through Hole Printing → Baking → Surface Copper Silkscreen Printing → Sintering → Solder Mask → OSP |
Capability | • PTH hole: 0.3mm, pad: 0.6mm • Trace width/spacing: 0.075mm |
• CPTH hole: 0.4mm, copper pad: 1.1mm • Trace width/spacing: 0.15mm • Copper layer down to 5µm • Manufacture anywhere |
Limitations | • Toxic waste • High CO₂e • High energy use • Large equipment footprint • T/H qty ≤ 20K/m² • T/H current ≤ 500mA • Silkscreen accuracy ±0.15mm |
• Requires design optimization for additive • Early-stage market adoption |
CO₂e (vs. etched PCB) | 100% | ~40% |
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