LF300

LF300

Conductive Nano Copper ink, Paper based Flexible Applications 

Copprint LF300 Nano Copper Ink for high conductivity additive screen printing on paper.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: Paper 

Key Product Benefits 

• High conductivity 
• Very-low fabrication cost, efficient (no material waste) 
• Nano copper particle size for thin layer patterns 
• Excellent printability and adhesion on paper substrates 
• Rapid self-sintering, really simple fabrication in air environment 
• Non toxic, green circuits, environmentally friendly 

Drying: hot air
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application:  UHF and HF antenna & sensors 

TYPICAL PROPERTIES: UNCURED NANO COPPER PASTE 

Particle Size, μm <0.15
Solid Content, after 10 minutes @150ºC, 81±1%
Density, 2.7±0.15 g/ml
Viscosity @ 250C , DVEHA Brookfield spindle 14, 100rpm, mPa∙s (cps) 5000-9000
Thixotropic Index (1.5/15 s-1) 1.5±0.1
Coverage area @5μm dry film thickness, 17 m²/kg
Shelf Life, @<-10°C, 180 days
Flash Point – See Safety Data Sheet (SDS) 

Sintering cycle 
30 sec @ 270°C (Hot press)
5 sec @ 300°C (Laminator)

TYPICAL PROPERTIES: CURED NANO COPPER PASTE 

Adhesion: tape test 3M Scotch 234 (Passed)
Electrical Properties: Sheet Resistance, ohm/□/25 μm <0.003 

DIRECTIONS FOR NANO COPPER INK USE 

Copprint LF300 is supplied as a single-component formulation ready for use. 

SCREEN PROPERTIES 

Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 100 to 300  

STORAGE AND HANDLING 

Store sealed container under -10°C in a dry location.

For safe handling of Copprint Nano Ink consult the  Safety Data Sheet (SDS)

For technical data please see the  Technical Data Sheet (TDS)

For application notes please see the LF-300 Application notes