The Latest from Copprint

Copprint LF-301 Nano Copper Ink for high conductivity additive screen printing on paper.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: Paper

Key Product Benefits

• High conductivity
• Very-low fabrication cost, efficient (no material waste)
• Nano copper particle size for thin layer patterns
• Excellent printability and adhesion on paper substrates
• Rapid self-sintering, really simple fabrication in air environment
• Non toxic, green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: printing, UHF, NFC,HF RFID antennas on a paper substrate

Copprint LF-360 Nano Copper Ink for high conductivity screen printing on PET/PC substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PET/PC

Key Product Benefits

• High conductivity
• Excellent adhesion
• Excellent printability with screen printing
• High metal loading
• High flexibility

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: R2R or Heat press
Application: Conductive Nano Copper Ink
Common Applications: Printing Heaters, sensors, antennas, membrane switches and more.

Copprint LF-371 Nano Copper Ink for high conductivity additive thick screen-printing on FR4, Glass, Alumina.

Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: FR4, Glass, Alumina

Key Product Benefits

• Ultra high conductivity
• Excellent adhesion
• Very-low fabrication cost, efficient (no material waste)
• Hybrid ink – Micro and nano Cu particles.
• Excellent printability with screen printing
• Rapid self-sintering, really simple fabrication in air environment
• Non toxic, green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: FPCB and PCB

Copprint LF-370 Nano Copper Ink for high conductivity additive screen printing on R4, Glass, Alumina.

Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: FR4, Glass, Alumina

Key Product Benefits

• Ultra high conductivity
• Excellent adhesion
• Very-low fabrication cost, efficient (no material waste)
• Hybrid ink – Micro and nano Cu particles.
• Excellent printability with screen printing
• Rapid self-sintering, really simple fabrication in air environment
• Non toxic, green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: FPCB and PCB

Copprint LF-390 Nano Copper Ink for high conductivity additive screen printing on PI substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PI

Key Product Benefits

• High conductivity
• Very-low fabrication cost
• Nano copper particle size for pattern precision
• Excellent printability and adhesion on PI substrates
• Rapid self-sintering, really simple fabrication in air environment
• Green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press
Application: Conductive Nano Copper Ink for Additive Printing
Common Applications: Flexible PCBs on PI

Copprint LF-350 Nano Copper Ink for high conductivity screen printing on PET substrates.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: PET

Key Product Benefits

• High conductivity
• Very-low fabrication cost
• Nano copper particle size for pattern precision
• Excellent printability and adhesion on PET substrates
• Rapid self-sintering, really simple fabrication in air environment
• Green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press
Application: Conductive Nano Copper Ink for Additive Printing
Common Applications: Printing Heaters, antennas, membrane switches and more.

Copprint LF-300 Nano Copper Ink for high conductivity additive screen printing on paper.
Technology: Screen printing
Appearance: Copper paste
Filler Type: Copper
Substrate: Paper

Key Product Benefits

• High conductivity
• Very-low fabrication cost, efficient (no material waste)
• Nano copper particle size for thin layer patterns
• Excellent printability and adhesion on paper substrates
• Rapid self-sintering, really simple fabrication in air environment
• Non toxic, green circuits, environmentally friendly

Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: printing, UHF, NFC,HF RFID antennas on a paper substrate