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    LOPEC 2022 Startup award!

    Copprint is honored to be selected as a 2022 Edison Awards finalist. We are proud to be recognized by this prestigious award for the significant positive environmental impact of Copprint Nano Copper inks. We are making sustainable manufacturing of electronic circuits and compostable green electronics a reality, for printed RFID antennas and circuits everywhere.   […]

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    Copprint is honored to be selected as a 2022 Edison Awards finalist.

    Copprint is honored to be selected as a 2022 Edison Awards finalist.

    Copprint is honored to be selected as a 2022 Edison Awards finalist.

    Copprint is honored to be selected as a 2022 Edison Awards finalist.
    We are proud to be recognized by this prestigious award for the significant positive environmental impact of Copprint Nano Copper inks. We are making sustainable manufacturing of electronic circuits and compostable green electronics a reality, for printed RFID antennas and circuits everywhere.

     

    https://www.linkedin.com/posts/shochet_copprint-edisonawards-printedelectronics-activity-6897214609426649088-7vn1

     

     

    Copprint powered products. Great picture from a Chinese customer. Four products made with Copprint’s conductive copper paste on glass and aluminum. Instead of a polluting etching process, a sustainable lower-cost printing process is implemented.     https://lnkd.in/d5r-q7wE

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    Copprint powered products.

    Copprint powered products.

    Copprint powered products.

    Copprint powered products.
    Great picture from a Chinese customer. Four products made with Copprint’s conductive copper paste on glass and aluminum.
    Instead of a polluting etching process, a sustainable lower-cost printing process is implemented.

     

     

    https://lnkd.in/d5r-q7wE

      Thank you Dominik Rudolph, Rüdiger Farneda, Tudor Timofte, Andreas Halm, Joris Libal , Andy, Ning Chen , Dr. Florian Buchholz for your pioneering work with printed copper traces. And to Yitzchak (Isaac) Rosen, who leads this activity on the Copprint side. Their work was presented at the Metallization & Interconnection workshop for crystalline silicon […]

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    Solar cells with Copper (busbars) and less than 25mg of Silver (fingers) are demonstrated by ISC Konstanz.

    Solar cells with Copper (busbars) and less than 25mg of Silver (fingers) are demonstrated by ISC Konstanz.

    Solar cells with Copper (busbars) and less than 25mg of Silver (fingers) are demonstrated by ISC Konstanz.

     

    Thank you Dominik Rudolph, Rüdiger Farneda, Tudor Timofte, Andreas Halm, Joris Libal , Andy, Ning Chen , Dr. Florian Buchholz for your pioneering work with printed copper traces. And to Yitzchak (Isaac) Rosen, who leads this activity on the Copprint side. Their work was presented at the Metallization & Interconnection workshop for crystalline silicon solar cells: https://lnkd.in/dHDigsNU

    Many people do not know that conductive silver pastes account for 10-30% of the cost of Solar modules production.
    The solar cell industry already consumes ~12% of global silver production. PV production is expected to increase fivefold in the following years, increasing worldwide Silver mining/production demand by 50%. However, this would drive up silver prices to insane levels, making solar cells extremely expensive. The simplest way to overcome this issue and cut production costs dramatically is to switch to conductive copper printing.

    Join our copper printing revolution.

     

    https://www.linkedin.com/posts/shochet_isc-copprint-printedelectronics-activity-6884109697075449857-Zo7H/

     

    Additive Manufacturing of Electronics requires good soldering and is enabled with Copprint’s conductive copper inks, as demonstrated by the formation of an IMC layer (Inter Metallic Compound). This layer is formed during reflow between the solder alloy and printed conductive copper paste and is the index of good soldering (see explanation here ).   Full process […]

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    Excellent soldering on conductive copper ink demonstrated by the formation of an IMC (InterMetallic Compound) layer

    Excellent soldering on conductive copper ink demonstrated by the formation of an IMC (InterMetallic Compound) layer

    Excellent soldering on conductive copper ink demonstrated by the formation of an IMC (InterMetallic Compound) layer

    Additive Manufacturing of Electronics requires good soldering and is enabled with Copprint’s conductive copper inks, as demonstrated by the formation of an IMC layer (Inter Metallic Compound). This layer is formed during reflow between the solder alloy and printed conductive copper paste and is the index of good soldering (see explanation here ).

     

    Full process details:

    1. Print copper traces on FR4 substrate with Copprint copper pastes.
    2. Soldering process – can be done even one week after sintering.
      1. Print off-the-shelf solder paste. (The most recommended paste is Henkel Loctite LF-318).
      2. Component placement.
      3. Standard reflow process.

    Die shear tests after the process indicated >3Kgf for 1206 SMD resistor soldered on Copprint’s LF360 with SAC305 Loctite LF-318.

     

    Copprint is proud to be a Copper Sponsor for CPES2021. For further info see “intelliFLEX to present Virtual CPES2021, March 17-19, 2021”    

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    Copper Sponsor for CPES2021
    Copprint-Tatsuta

    We are honored to have TATSUTA Electric Wire and Cable Co., Ltd. as a new investor at Copprint, joining Henkel and HP. https://lnkd.in/du2YjGS See on LinkedIn      

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    Copprint-Tatsuta

    We are excited to announce two new top-performing nano-copper paste: LF-371 for thick printing on multiple substrates such as FR4, Glass, Alumina, Aluminum, Ceramics. LF-390 for printing on Polyimide (PI). Best conductivity among conductive pastes and best price/performance.  

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    Announcing two new products – LF390 for PI, LF371 for Thick printing

    Announcing two new products – LF390 for PI, LF371 for Thick printing

    Announcing two new products – LF390 for PI, LF371 for Thick printing

    We are excited to announce two new top-performing nano-copper paste:

    LF-371 for thick printing on multiple substrates such as FR4, Glass, Alumina, Aluminum, Ceramics.

    LF-390 for printing on Polyimide (PI).

    Best conductivity among conductive pastes and best price/performance.

     

    #HTVD is one of Europe’s leading meeting places for tech companies, international investors, and corporates and is launching on October 13 in Dresden, Germany. https://lnkd.in/d8sSyXi www.copprint.com #HTVD #HTVD20 #HTVD2020 #copprint

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    Copprint is selected as 1 out of 40 best European High-tech Start-ups to pitch at the High Tech Venture days 2020!

    Take an FR4 board, drill holes (2 minutes), print Copprint’s LF370 paste on both sides (2 minutes), sinter (3 seconds) and you are done. Tens of circuits in one hour. The cheapest and fastest way to fabricate short and medium series of simple circuit boards. – Highest conductivity among all conductive pastes. – Sheet resistance […]

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    Printed circuit board using Copprint’s copper ink in a few minutes

    Printed circuit board using Copprint’s copper ink in a few minutes

    Printed circuit board using Copprint’s copper ink in a few minutes

    Take an FR4 board, drill holes (2 minutes), print Copprint’s LF370 paste on both sides (2 minutes), sinter (3 seconds) and you are done. Tens of circuits in one hour.
    The cheapest and fastest way to fabricate short and medium series of simple circuit boards.

    – Highest conductivity among all conductive pastes.
    – Sheet resistance ~2.2mΩ/□/mil
    – Cheaper than etching.
    – 5-10x cheaper than silver inks
    – Environmental friendly process.
    – Excellent adhesion and durability
    – Solderable
    – See more at https://lnkd.in/gnz88Vb

    For more information on additive manufactured electronics see www.copprint.com

    #copprint #PCBs #printedelectronics #lopec #PCB #conductiveinks #printedcircuitboards #nanocopper #AME #additivemanufacturing #electronics #3dprinting #electronics

     

    Original post – https://www.linkedin.com/posts/shochet_copprint-pcbs-printedelectronics-activity-6714202019382616065-AtDB