We are Copprint, a Nano Copper Ink Company.
Interested in learning how Nano Copper Inks can help you print additive copper flexible electronics?
Printed electronic circuits are all around us.
Copprint is ushering in a new era of printed electronics, empowering ubiquitous conductivity.
Our rapid self-sintering Nano Copper Inks enable very-low cost, high conductivity, environmentally friendly printed electronics, embedded everywhere.
Learn MoreAnything you can print with conductive silver inks, Copprint can do better, faster.
At a fraction of the cost.
Copprint Nano Copper Inks match top silver inks for any printed pattern, with high conductivity of (<3 mΩ/□/mil).
From 3-5X cost savings of copper inks compared to silver. Up to 90% material savings compared to etched aluminum and copper.
Substrate freedom for printed electronics on paper, PET, PEN, Teslin, PI, FR4, fabrics and more.
Oxidation free high conductivity copper printing, in air environment with rapid heating and sintering at 180-300°C and curing for fast throughput and high yield embedded electronics printing.
Simple print, dry, sinter fabrication using standard, low cost equipment. No need for photonic sintering or expensive lasers. Robust conductive elements with tested Thermal-Humidity resistance (up to 1000h at 85 °C / 85 RH).
No hazardous materials, can be used everywhere. Copprint nano copper inks printed on a paper substrate are fully compostable, ensuring a minimal ecological footprint for green circuits everywhere.
Copprint brings all the advantages of additive manufacturing to printed electronics across all scales and substrates.
Copprint is enabling additive printing for ubiquitous conductivity for a range of embedded electronic markets: RFID antenas, Heterojunction Photovoltaic (PV) cells, Flexible electronics and PCBs on PET, PI, PC, conductive fabrics, patterns, batteries and many more.
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AnnouncementAdditive Manufacturing of Electronics requires good soldering and is enabled with Copprint’s conductive copper inks, as demonstrated by the formation of an IMC layer (Inter Metallic Compound). This layer is formed during reflow between the solder alloy and printed conductive copper paste and is the index of good soldering (see explanation here ). Full process […]
EventCopprint is proud to be a Copper Sponsor for CPES2021. For further info see “intelliFLEX to present Virtual CPES2021, March 17-19, 2021”
AnnouncementWe are honored to have TATSUTA Electric Wire and Cable Co., Ltd. as a new investor at Copprint, joining Henkel and HP. https://lnkd.in/du2YjGS See on LinkedIn